Specifications:
1. Total power: 3000 W
2. Top heater: 800 W
3. Bottom heater: 2000 W
4. Power supply: single-phase 220 VAC 50/60Hz 3KVA
5. Machine Dimension: 450 กม 380 กม 580mm
6. Temperature control: high-precision K Sensor
7. Positioning: V-groove for PCB positioning, Max PCB size: 300 กม 320mm
8. Weight: About 25 kg
Features:
1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely.
2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.
3. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it.
4. Choose imported high-precision thermocouple to detect the top/bottom temperature precisely.
5. Top & bottom heating can be controlled independently by the temperature graphs.A cross-flow fan cools rapidly to protect the PCB from deformation when welding.
6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering. |
